Vertical packaging of optical fibres for illuminating photonic integrated circuit (PIC) devices or detectors, at room and cryogenic temperatures. All-glass or silicon packaging enables robust coupling of hundreds of fibres with a µm-level positioning accuracy and small footprint (pitch < 250 µm) on customer devices. Assembly of components can be based on laser soldered metal/alloy joints and gluing. Design of the layout is done in collaboration with the user.