This process is suitable for fabrication of indium bumps for flip chip bonding of superconducting qubits or other circuits requiring a similarly high degree of coherence. Resonator quality factors in the range of 1M and qubit coherence times in the range of one hundred microseconds have been measured in modules that have undergone this process. Flip chip bonding is also included in this service. Under-bump metallization is to be agreed upon on case-by-case basis, depending on other metallization used on the chips. Specifications: Standard top chip sizes: 8 mm x 8 mm, 10 mm x 10 mm, 12 mm x 12 mm (others on case-by-case basis) Standard substrate chip sizes: 10 mm x 10 mm, 14 mm x 14 mm, 20 mm x 20 mm (others on case-by-case basis) Max. chip-to-chip distance: 5 µm Keep-out diameter around bumps: 50 µm