3-inch wafer with III-V SPADs
3-inch wafer with III-V SPADs
Fabrication of III-V APDs and SPADs
Fraunhofer IAF
Qu-Pilot
The offered development services of III-V photonic components aim particularly for APDs and SPADs for the short-wave infrared spectral bands with detection wavelengths around 1550 nm. For this purpose, Fraunhofer IAF can draw on its long-standing III-V epitaxy and process technology for the InGaAs/InP-based material system. The fabricated detector devices can be I-V characterised on-wafer and electro-optically characterised on-chip in a dedicated lab setup. Epitaxial growth and process technology of III-V optoelectronic components, especially InGaAs/InP pin-PDs, APDs, and SPADs. Wafer diameters: 76.2 mm (3 inch), 100 mm (4 inch), multi-project wafer compatible
SEM image of a single InGaAs/InP SPAD with 10-µm active diameter
SEM image of a single InGaAs/InP SPAD with 10-µm active diameter
III-V SPAD devices and process test structures ready for on-wafer characterisation
III-V SPAD devices and process test structures ready for on-wafer characterisation
Sensing Communication
4
Photonics 
Prototyping  Fabrication