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Indium bump
Flip-chip bonding
Organization name
VTT-Technical Research Centre of Finland Ltd
Service
Qu-Pilot
Description
This process is suitable for low-loss bonding of control/multiplexer chips to quantum or test chips. The bonding is based on superconducting In-bump technology. VTT has fabricated a large number of superconducting In bumps on various samples and demonstrated the capability to perform the flip-chip fabrication steps without degrading the performance of qubits on the quantum chip (https://doi.org/10.1088/2058-9565/ac734b).
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Micrograph of two In-bumps fabricated by VTT on a test structure.
Document 1
Document 2
Applications
Sensing
Computing
Communication
TRL
4
Platform
Semiconducting
Superconducting
Offering type
Prototyping
Fabrication
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